Product
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Thermal Conductivity Diamond Powder
Classification:
Thermal Conductivity Diamond Powder
Product Details
The Advantages of Diamond
- Ultra-high thermal conductivity: Diamond boasts a thermal conductivity coefficient (1000–2000 W/(m·K)) that far surpasses traditional fillers such as Al₂O₃ and BN, significantly enhancing the thermal conductivity of colloids. Diamond-based thermally conductive adhesives exhibit a thermal conductivity ranging from 1 to 14 W/(m·K), depending on the diamond grade and filling ratio.
- Insulation performance: Ideal for electronic cooling applications requiring electrical insulation (e.g., CPUs, LEDs, power devices).
- High-temperature resistance: Capable of withstanding high-temperature environments, enhancing the thermal stability of the colloid.
Typical Application Scenarios
Electronic Cooling: Adhesive bonding of CPU/GPU heat sinks, LED packaging, and potting of IGBT modules.
High-power devices: Thermal Interface Materials (TIM) for 5G base stations and power modules in new-energy vehicles.
Aerospace: High-temperature and high-thermal-conductivity adhesives designed for heat dissipation in equipment operating under extreme conditions.
By rationally designing the formulation and process, diamond micron powder can significantly enhance the thermal conductivity of adhesive materials, making it suitable for high-end heat dissipation applications. If further cost reduction is desired, consider adopting a mixed filler approach or optimizing the particle size distribution.
Multi-level grading filling: Mixing particles of different sizes reduces voids, creating a denser thermal conduction network.
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